Wettability plays an important role in the integrity of solder joints especially in critical safety operations. It helps in attaining successful soldering and reliable solder joints. The angle of wettability determines the degree of solder contact and strength of the solder joint. Moreover, the contact angle between the solid substrate and the molten solder determines the interconnection reliability. This paper focuses on the wettability of lead free solder on OSP and bare copper substrate surface finishes. The wetting behaviour of lead free solder pastes on bare copper board and Organic Solderability Preservatives (OSPs) substrates were investigated. The test vehicles consist of FR4 PCB single sided 100% copper clad with a thick film metallization and FR4 PCB single sided OSP. The substrate dimension was 100 mm×160 mm×1.6 mm. A total of 480 bumps of Lead-free solder pastes (96Sn-3.8Ag-0.5Cu and 96.5Sn-3.0Ag-0.7Cu alloy composition) were deposited for the investigation. The printing parameters and their values for the experiments include print gap of 0 mm, squeegee speed of 20 mm/s, pressure of 8kg and separation speed of 3 mm/sec. The pastes are screen printed on the substrates using 0.125mm thick stencil mounted on DEK 260 series printing machine. After the stencil printing process, the solder bumps deposited on the substrates were reflowed using a Novostar 2000HT horizontal convention reflow oven with 4-stage (preheat-soak-reflow-cooling). The FTA188 Analyser was employed for measuring the angle of contact between the substrates and the bumps. The results showed that the wetting contact angle of copper surface finish is lower as compared to the organic solderability preservatives surface finish and the wetting angle decreases as the contact surface area increases.
| Published in | International Journal of Materials Science and Applications (Volume 4, Issue 3) |
| DOI | 10.11648/j.ijmsa.20150403.14 |
| Page(s) | 165-172 |
| Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
| Copyright |
Copyright © The Author(s), 2015. Published by Science Publishing Group |
Wettability, Solder Pastes, Surface Finish, Contact Angle
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APA Style
Gabriel Takyi, Peter Kojo Bernasko. (2015). Investigation of Wettability of Lead Free-Solder on Bare Copper and Organic Solder Preservatives Surface Finishes. International Journal of Materials Science and Applications, 4(3), 165-172. https://doi.org/10.11648/j.ijmsa.20150403.14
ACS Style
Gabriel Takyi; Peter Kojo Bernasko. Investigation of Wettability of Lead Free-Solder on Bare Copper and Organic Solder Preservatives Surface Finishes. Int. J. Mater. Sci. Appl. 2015, 4(3), 165-172. doi: 10.11648/j.ijmsa.20150403.14
AMA Style
Gabriel Takyi, Peter Kojo Bernasko. Investigation of Wettability of Lead Free-Solder on Bare Copper and Organic Solder Preservatives Surface Finishes. Int J Mater Sci Appl. 2015;4(3):165-172. doi: 10.11648/j.ijmsa.20150403.14
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Download@article{10.11648/j.ijmsa.20150403.14,
author = {Gabriel Takyi and Peter Kojo Bernasko},
title = {Investigation of Wettability of Lead Free-Solder on Bare Copper and Organic Solder Preservatives Surface Finishes},
journal = {International Journal of Materials Science and Applications},
volume = {4},
number = {3},
pages = {165-172},
doi = {10.11648/j.ijmsa.20150403.14},
url = {https://doi.org/10.11648/j.ijmsa.20150403.14},
eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijmsa.20150403.14},
abstract = {Wettability plays an important role in the integrity of solder joints especially in critical safety operations. It helps in attaining successful soldering and reliable solder joints. The angle of wettability determines the degree of solder contact and strength of the solder joint. Moreover, the contact angle between the solid substrate and the molten solder determines the interconnection reliability. This paper focuses on the wettability of lead free solder on OSP and bare copper substrate surface finishes. The wetting behaviour of lead free solder pastes on bare copper board and Organic Solderability Preservatives (OSPs) substrates were investigated. The test vehicles consist of FR4 PCB single sided 100% copper clad with a thick film metallization and FR4 PCB single sided OSP. The substrate dimension was 100 mm×160 mm×1.6 mm. A total of 480 bumps of Lead-free solder pastes (96Sn-3.8Ag-0.5Cu and 96.5Sn-3.0Ag-0.7Cu alloy composition) were deposited for the investigation. The printing parameters and their values for the experiments include print gap of 0 mm, squeegee speed of 20 mm/s, pressure of 8kg and separation speed of 3 mm/sec. The pastes are screen printed on the substrates using 0.125mm thick stencil mounted on DEK 260 series printing machine. After the stencil printing process, the solder bumps deposited on the substrates were reflowed using a Novostar 2000HT horizontal convention reflow oven with 4-stage (preheat-soak-reflow-cooling). The FTA188 Analyser was employed for measuring the angle of contact between the substrates and the bumps. The results showed that the wetting contact angle of copper surface finish is lower as compared to the organic solderability preservatives surface finish and the wetting angle decreases as the contact surface area increases.},
year = {2015}
}
TY - JOUR T1 - Investigation of Wettability of Lead Free-Solder on Bare Copper and Organic Solder Preservatives Surface Finishes AU - Gabriel Takyi AU - Peter Kojo Bernasko Y1 - 2015/04/30 PY - 2015 N1 - https://doi.org/10.11648/j.ijmsa.20150403.14 DO - 10.11648/j.ijmsa.20150403.14 T2 - International Journal of Materials Science and Applications JF - International Journal of Materials Science and Applications JO - International Journal of Materials Science and Applications SP - 165 EP - 172 PB - Science Publishing Group SN - 2327-2643 UR - https://doi.org/10.11648/j.ijmsa.20150403.14 AB - Wettability plays an important role in the integrity of solder joints especially in critical safety operations. It helps in attaining successful soldering and reliable solder joints. The angle of wettability determines the degree of solder contact and strength of the solder joint. Moreover, the contact angle between the solid substrate and the molten solder determines the interconnection reliability. This paper focuses on the wettability of lead free solder on OSP and bare copper substrate surface finishes. The wetting behaviour of lead free solder pastes on bare copper board and Organic Solderability Preservatives (OSPs) substrates were investigated. The test vehicles consist of FR4 PCB single sided 100% copper clad with a thick film metallization and FR4 PCB single sided OSP. The substrate dimension was 100 mm×160 mm×1.6 mm. A total of 480 bumps of Lead-free solder pastes (96Sn-3.8Ag-0.5Cu and 96.5Sn-3.0Ag-0.7Cu alloy composition) were deposited for the investigation. The printing parameters and their values for the experiments include print gap of 0 mm, squeegee speed of 20 mm/s, pressure of 8kg and separation speed of 3 mm/sec. The pastes are screen printed on the substrates using 0.125mm thick stencil mounted on DEK 260 series printing machine. After the stencil printing process, the solder bumps deposited on the substrates were reflowed using a Novostar 2000HT horizontal convention reflow oven with 4-stage (preheat-soak-reflow-cooling). The FTA188 Analyser was employed for measuring the angle of contact between the substrates and the bumps. The results showed that the wetting contact angle of copper surface finish is lower as compared to the organic solderability preservatives surface finish and the wetting angle decreases as the contact surface area increases. VL - 4 IS - 3 ER -
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