As semiconductors devices scale down, silicon transistors would reach its limitation below 10 nm. Researching for the novel materials, which could replace silicon, is important. In this study, the new potential materials III-V Group compound semiconductors which are ion implanted with low energy and low dose. In order to keep the ultra-shallow junction and get the best activation, the new annealing technology ─ microwave annealing (MWA) is employed. Microwave annealing is a processing with low energy and longer period. In contrast to the conventional high thermal annealing methods such as rapid thermal annealing (RTA), it is a process with high temperature and ultra-short time. However, the high temperature could cause the dopants diffusion and the ultra-short time might make the destroyed lattices repaired not completely. Ion implant with silicon at different temperature (80°C, and 150°C) into In0.47Ga0.53As(300 nm)/InP substrate, and annealed by low-energy MWA and traditional RTA, respectively to research SPER and electrical activation. By using Raman spectrum, we discover that using MWA energy 2.5P(1.5kW) for 100 s could make the III-V materials achieve SPER by repairing fully. From TEM images, the amorphous layer caused by ion implantation could be recovered to crystal lattices during implantation temperature at 150°C. After annealing by MWA 2.5P(1.5kW) for 100 s, the defects of stacking faults are repaired completely to attain SPER, and it can correspond the Raman results. By using SIMS analysis, it can demonstrate that MWA has better ability to control dopants diffusion. Finally, by using Photoluminescence spectroscopy analysis, the MWA energy 3P(1.8kW) for 100 s could just make silicon dopants get activation. After annealing by MWA 3.5P(2.1kW) for 100 s of implantation at 150°C has the best activation that it has the highest peak.
Published in | International Journal of Materials Science and Applications (Volume 6, Issue 3) |
DOI | 10.11648/j.ijmsa.20170603.16 |
Page(s) | 148-153 |
Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
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Copyright © The Author(s), 2017. Published by Science Publishing Group |
III-V Group, Microwave Annealing, Activation
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APA Style
Tzu-Lang Shih, Wen-Hsi Lee. (2017). Studies on Activation of High-Mobility III-V Group Semiconductor Materials by Using Microwave Annealing. International Journal of Materials Science and Applications, 6(3), 148-153. https://doi.org/10.11648/j.ijmsa.20170603.16
ACS Style
Tzu-Lang Shih; Wen-Hsi Lee. Studies on Activation of High-Mobility III-V Group Semiconductor Materials by Using Microwave Annealing. Int. J. Mater. Sci. Appl. 2017, 6(3), 148-153. doi: 10.11648/j.ijmsa.20170603.16
AMA Style
Tzu-Lang Shih, Wen-Hsi Lee. Studies on Activation of High-Mobility III-V Group Semiconductor Materials by Using Microwave Annealing. Int J Mater Sci Appl. 2017;6(3):148-153. doi: 10.11648/j.ijmsa.20170603.16
@article{10.11648/j.ijmsa.20170603.16, author = {Tzu-Lang Shih and Wen-Hsi Lee}, title = {Studies on Activation of High-Mobility III-V Group Semiconductor Materials by Using Microwave Annealing}, journal = {International Journal of Materials Science and Applications}, volume = {6}, number = {3}, pages = {148-153}, doi = {10.11648/j.ijmsa.20170603.16}, url = {https://doi.org/10.11648/j.ijmsa.20170603.16}, eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijmsa.20170603.16}, abstract = {As semiconductors devices scale down, silicon transistors would reach its limitation below 10 nm. Researching for the novel materials, which could replace silicon, is important. In this study, the new potential materials III-V Group compound semiconductors which are ion implanted with low energy and low dose. In order to keep the ultra-shallow junction and get the best activation, the new annealing technology ─ microwave annealing (MWA) is employed. Microwave annealing is a processing with low energy and longer period. In contrast to the conventional high thermal annealing methods such as rapid thermal annealing (RTA), it is a process with high temperature and ultra-short time. However, the high temperature could cause the dopants diffusion and the ultra-short time might make the destroyed lattices repaired not completely. Ion implant with silicon at different temperature (80°C, and 150°C) into In0.47Ga0.53As(300 nm)/InP substrate, and annealed by low-energy MWA and traditional RTA, respectively to research SPER and electrical activation. By using Raman spectrum, we discover that using MWA energy 2.5P(1.5kW) for 100 s could make the III-V materials achieve SPER by repairing fully. From TEM images, the amorphous layer caused by ion implantation could be recovered to crystal lattices during implantation temperature at 150°C. After annealing by MWA 2.5P(1.5kW) for 100 s, the defects of stacking faults are repaired completely to attain SPER, and it can correspond the Raman results. By using SIMS analysis, it can demonstrate that MWA has better ability to control dopants diffusion. Finally, by using Photoluminescence spectroscopy analysis, the MWA energy 3P(1.8kW) for 100 s could just make silicon dopants get activation. After annealing by MWA 3.5P(2.1kW) for 100 s of implantation at 150°C has the best activation that it has the highest peak.}, year = {2017} }
TY - JOUR T1 - Studies on Activation of High-Mobility III-V Group Semiconductor Materials by Using Microwave Annealing AU - Tzu-Lang Shih AU - Wen-Hsi Lee Y1 - 2017/05/10 PY - 2017 N1 - https://doi.org/10.11648/j.ijmsa.20170603.16 DO - 10.11648/j.ijmsa.20170603.16 T2 - International Journal of Materials Science and Applications JF - International Journal of Materials Science and Applications JO - International Journal of Materials Science and Applications SP - 148 EP - 153 PB - Science Publishing Group SN - 2327-2643 UR - https://doi.org/10.11648/j.ijmsa.20170603.16 AB - As semiconductors devices scale down, silicon transistors would reach its limitation below 10 nm. Researching for the novel materials, which could replace silicon, is important. In this study, the new potential materials III-V Group compound semiconductors which are ion implanted with low energy and low dose. In order to keep the ultra-shallow junction and get the best activation, the new annealing technology ─ microwave annealing (MWA) is employed. Microwave annealing is a processing with low energy and longer period. In contrast to the conventional high thermal annealing methods such as rapid thermal annealing (RTA), it is a process with high temperature and ultra-short time. However, the high temperature could cause the dopants diffusion and the ultra-short time might make the destroyed lattices repaired not completely. Ion implant with silicon at different temperature (80°C, and 150°C) into In0.47Ga0.53As(300 nm)/InP substrate, and annealed by low-energy MWA and traditional RTA, respectively to research SPER and electrical activation. By using Raman spectrum, we discover that using MWA energy 2.5P(1.5kW) for 100 s could make the III-V materials achieve SPER by repairing fully. From TEM images, the amorphous layer caused by ion implantation could be recovered to crystal lattices during implantation temperature at 150°C. After annealing by MWA 2.5P(1.5kW) for 100 s, the defects of stacking faults are repaired completely to attain SPER, and it can correspond the Raman results. By using SIMS analysis, it can demonstrate that MWA has better ability to control dopants diffusion. Finally, by using Photoluminescence spectroscopy analysis, the MWA energy 3P(1.8kW) for 100 s could just make silicon dopants get activation. After annealing by MWA 3.5P(2.1kW) for 100 s of implantation at 150°C has the best activation that it has the highest peak. VL - 6 IS - 3 ER -